Schalast | News | Press

Sensitive robots made in Germany: Schalast advises Wika on joint venture with Wittenstein

20.03.2023, News,Press

Schalast has advised measuring equipment specialist WIKA Alexander Wiegand SE & Co. KG and the mechatronics corporation WITTENSTEIN SE on an intended joint venture. The new Resense GmbH is to drive forward the development, manufacturing and marketing miniaturized 6-axis force /torque sensors for the industrial market.

“The joint venture will seek to carve out a leading role for itself in the future market for haptic sensors. We’re convinced that this form of cooperation will allow the strengths of both partners to be optimally exploited and help us reach our common goal faster”, said Dr Bertram Hoffmann, CEO of the WITTENSTEIN group. “Our novel silicon bonding technology can make a key difference here, and we see this as a great opportunity to grow together in the exciting robotics segment”, added Alexander Wiegand, CEO of the WIKA group.

Kristof Schnitzler, Corporate Partner at Schalast, explains: "From our point of view, this joint venture is groundbreaking in many respects. Resense has the potential to bring about pioneering developments in the robotics sector. The new technologies can provide the necessary leverage to advance the German pioneering role in engineering - "made in Germany" - in a future-oriented way. That is why we believe such a form of joint venture in the SME sector is also the decisive development in the German and European M&A market."

The joint venture is based on an innovation by the WITTENSTEIN group: miniaturized hollow-shaft multi-axis sensors for highly precise measurement of forces and torques in confined spaces. This patented concept paves the way for the smallest 6-axis haptic sensors anywhere in the world. They are used in medical research, humanoid robots and precision manipulation in industrial applications. As a leader in the manufacture of industrial measurement technology, WIKA can contribute high-tech manufacturing expertise in the field of sensor and chip components.